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DIAMOND WIRES

 

We manufacture and provide a portfolio of diamond wires from 60 µm to 400 µm in diameter.

 

MAIN BENEFITS of our DIAMOND WIRES ARE:

  •   REDUCED COST OF OWNERSHIP  

Faster cut times 

6 - 8 x faster than slurry, application dependent

Increased capacity with lower capital expenditures

Faster ROI to justify initial capital investment

Roadmap to lower wafer cost and higher throughput:

Lower cost resulting from reduced TCO

Less expensive secondary process costs

Re-use of wire / Reduced utilities

Less plant complexity:

Reduced running costs such as electricity and cooling water

Bundled consumables for optimized processing  

  

  • HIGHER THROUGHPUT :

Flatter wafers - Roadmap for thinner wafers / Holistic approach to cutting /Improved wafer topology / Excellent cutting accuracy

  • MAINTENANCE & ENVIRONMENT FRIENDLY:

Fewer wire spool changes / Cleaner and faster process / Ability to use water-based cutting fluids

  • SEAMLESS INTEGRATION INTO EXISTING WAFERLINE SYSTEMS

 

We can assist and support you with the introduction of water-based diamond slicing in your facility.

Through IWT expertise, we are able to offer a consumables package that allows for maximized performance, lower CoO, and increased yield and throughput.

  

Please download all technicals details about our diamond wires :

 

 Electro Plated Diamond Wire