We manufacture and provide a portfolio of diamond wires from 60 µm to 400 µm in diameter.
- REDUCED COST OF OWNERSHIP
- HIGHER THROUGHPUT :
Flatter wafers - Roadmap for thinner wafers / Holistic approach to cutting /Improved wafer topology / Excellent cutting accuracy
- MAINTENANCE & ENVIRONMENT FRIENDLY:
Fewer wire spool changes / Cleaner and faster process / Ability to use water-based cutting fluids
- SEAMLESS INTEGRATION INTO EXISTING WAFERLINE SYSTEMS
We can assist and support you with the introduction of water-based diamond slicing in your facility.
Through IWT expertise, we are able to offer a consumables package that allows for maximized performance, lower CoO, and increased yield and throughput.
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