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We design and manufacture diamond saws and diamond wires able to slice brittle materials like: Silicon, Silicon Carbide, Sapphire, Quartz, Fused Silica, CZT, PbTe, BiTe, NdYag, Ruby, etc…

Making consistently new technological advances, we meet the expectations of our customers, for applications in high technology sectors: 

  • medical,
  • optical
  • photovoltaic,
  • electronics…

We supply saws and wire to Research institutes to improve cutting results in their laboratory and gain time.