We design and manufacture diamond saws and diamond wires able to slice brittle materials like: Silicon, Silicon Carbide, Sapphire, Quartz, Fused Silica, CZT, PbTe, BiTe, NdYag, Ruby, etc…
Making consistently new technological advances, we meet the expectations of our customers, for applications in high technology sectors:
- medical,
- optical
- photovoltaic,
- electronics…
We supply saws and wire to Research institutes to improve cutting results in their laboratory and gain time.